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Contact Info:
504 Boston Ave., Room 108
Tufts University
Medford, MA 02155

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Robert Hannemann
Professor of the Practice, Department of Mechanical Engineering


Sc.D., Massachusetts Institute of Technology, 1975
M.S., New York University, 1972
B.S., Illinois Institute of Technology, 1970

Research Interests

Conventional and alternative energy systems, multiphase flow and heat transfer, ultra-high-heat-flux heat transfer, electronics cooling, engineering leadership and education, the role of the engineer in society.


Dr. Hannemann joined Tufts in 2007 as Director of the Tufts Gordon Institute with a secondary appointment in the ME department. After seven years of dedicated service to the Gordon Institute, Professor Hannemann stepped down from the role of director. Prior to Tufts he was a researcher, manager, and entrepreneur in the computer and telecommunications industries with such companies as Digital Equipment Corporation, Corning, Inc., and Laserton. Early in his career he was employed at Bell Laboratories and was an Assistant Professor in the Mechanical Engineering department at the University of Maryland.


Dr. Hannemann's current technical research is focused on meso- and microscale cooling devices for high performance electronic devices using both single-phase and two-phase liquids. He is also actively researching energy-efficient data center cooling technologies. Other interests include researching and implementing new engineering education approaches aimed at fostering leadership, innovation, and entrepreneurship.

Selected Honors and Awards

2010 Named Fellow of the American Society of Mechanical Engineers
2007 IIT MMAE Department Alumni Recognition Award
1996 Digital Equipment Corporation Corporate Consultant Engineer
1977 ASME Henry Hess Award


1992 U.S. 5,158,912, Integral Heatsink Semiconductor Package
1990 U.S. 4,914,741, Tape Automated Bonding Semiconductor Package
1987 U.S. 4,833,567, Integral Heat Pipe Module
Three additional patents in process.

Representative Publications

R. Hannemann, Alan Kraus, and M. Michael Pecht, The Physical Architecture of VLSI Systems, John Wiley and Sons, New York (1994).

"Analysis of Alternative Data Center Cooling Approaches,' paper InterPACK-1176, ASME InterPACK '07, Vancouver (2007) (with Herman Chu).

"Thermal Design and Performance of Two-Phase Meso-Scale Heat Exchangers," paper HT2005-72743, ASME National Heat Transfer Conference, San Francisco (2005) (with J. Marsala and M. Pitasi).

"Physical Technology and the Air Cooling and Interconnection Limits for Mini- and Micro-Computers," Bulletin of the International Center for Heat and Mass Transfer3, 65-83 1990).

"Thermal Analysis and Design Considerations for a Dual-Beam Microwave Applicator for Hyperthermia Research," Journal of Biomechanical Engineering, vol. 101, 151-156 (1979) (with J. E. Robinson).

"An Analysis of the Effect of Surface Thermal Conductivity on the Rate of Heat Transfer in Dropwise Condensation," International Journal of Heat and Mass Transfer, vol. 19, 1299-1307 (1976) (with B. Mikic).