Contact Information
200 Boston Ave, Suite 2400
Tufts University
Medford, MA 02155
Tel: 617-627-3603
Fax: 617-627-3058
Email Professor
Robert Hannemann
Professor of the Practice, Department of Mechanical Engineering
Director, Tufts Gordon Institute
Education
Sc.D., Massachusetts Institute of Technology, 1975
M.S., New York University, 1972
B.S., Illinois Institute of Technology, 1970
Research Interests
Multiphase flow and heat transfer, ultra-high-heat-flux heat transfer,
electronics cooling, engineering leadership and education, the role of the
engineer in society, conventional and alternative energy systems.
Background
Dr. Hannemann joined Tufts in 2007 as Director of the Tufts Gordon Institute with a secondary appointment in the
ME department. Prior to Tufts he was a researcher, manager, and entrepreneur in
the computer and telecommunications industries with such companies as Digital
Equipment Corporation, Corning, Inc., and Laserton. Early in his career he was
employed at Bell Laboratories and was an Assistant Professor in the Mechanical
Engineering department at the University of Maryland.
 Research
Dr. Hannemann's current technical research is focused on meso- and microscale cooling devices
for high performance electronic devices using both single-phase and two-phase
liquids. He is also actively researching energy-efficient data center cooling
technologies.
At the Gordon Institute, he is researching and implementing
new engineering education approaches aimed at fostering leadership,
innovation, and entrepreneurship.
Selected Honors and Awards
2010 Named Fellow of the American Society of Mechanical Engineers
2007 IIT MMAE Department Alumni Recognition Award
1996 Digital Equipment Corporation Corporate Consultant Engineer
1977 ASME Henry Hess Award
Patents
1992 U.S. 5,158,912, Integral Heatsink Semiconductor Package
1990 U.S. 4,914,741, Tape Automated Bonding Semiconductor Package
1987 U.S. 4,833,567, Integral Heat Pipe Module
Three additional patents in process.
Representative Publications
R. Hannemann, Alan Kraus, and M. Michael Pecht, The Physical Architecture of
VLSI Systems, John Wiley and Sons, New York (1994).
"Analysis of Alternative Data Center Cooling Approaches,' paper InterPACK-1176,
ASME InterPACK '07, Vancouver (2007) (with Herman Chu).
"Thermal Design and Performance of Two-Phase Meso-Scale Heat Exchangers," paper
HT2005-72743, ASME National Heat Transfer Conference, San Francisco (2005) (with
J. Marsala and M. Pitasi).
"Physical Technology and the Air Cooling and Interconnection Limits for Mini-
and Micro-Computers," Bulletin of the International Center for Heat and Mass
Transfer 3, 65-83 1990).
"Thermal Analysis and Design Considerations for a Dual-Beam Microwave Applicator
for Hyperthermia Research," Journal of Biomechanical Engineering, vol.
101, 151-156 (1979) (with J. E. Robinson).
"An Analysis of the Effect of Surface Thermal Conductivity on the Rate of Heat
Transfer in Dropwise Condensation," International Journal of Heat and Mass
Transfer, vol. 19, 1299-1307 (1976) (with B. Mikic).
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