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504 Boston Ave., Room 202
Tufts University
Medford, MA 02155

Tel: 617.627.3239
Fax: 617.627.3058
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Michael A. Zimmerman
Professor of the Practice, Department of Mechanical Engineering


PhD, ME and Applied Mechanics, University of Pennsylvania, Philadelphia, PA, 1988 (Joint research at Cavendish Labs/Cambridge University, Cambridge, England)
SM,ME Fibers and Polymers Division, Massachusetts Institute of Technology, Cambridge, MA, 1981
BS,ME Rensselaer Polytechnic Institute, Troy, NY


Prof Zimmerman spent 14 years at Bell Labs, and rose to the highest technical level (top 1% of technical community). His area of expertise is polymer innovation and polymer processing, semiconductor packaging and electronic and optical materials. He subsequently started his own company (QLP, Inc.) by inventing a new liquid crystal polymer technology and developed products in the area of semiconductor packages, new printed circuit board materials, and revolutionary materials for replacing metals in automobiles. He developed strong collaborative relationships with Sumitomo Chemical, Dupont, Freescale Semiconductor, and General Motors, raised > $50M from Venture Capital firms and strategic partners, qualified the technology in several major applications, and sold the company to a multinational company (Interplex Industries). He has been teaching at Tufts for over 20 years, in the areas of materials science, manufacturing and finite element analysis and has developed new classes in the areas of polymer science and composite materials. He has developed projects for over 15 graduate students (MS and PhD), and has hired many of them. Currently he is involved in new funded research related to energy storage materials. He has collaborations with both the Electrical Engineering and Civil Engineering Departments.

Research Interest

Prof. Zimmerman's areas of expertise are in materials, processing, design for manufacture, computer simulations, new product ideas, and electronic packaging. He is an entrepreneur and visionary with extensive international work experience in Europe and Asia, understands the entrepreneurial and start-up world.

Professional Positions

  • 2012-present Founder and Head, iQLP incubation laboratory and new stealth energy storage venture
  • 2002 Founder, CTO and Board Member Quantum Leap Packaging, Wilmington, MA, sold to Interplex Industries.
  • 1990-present Professor of Practice/Advisory Board/Lecturer Tufts University
  • 1988-2002Consulting, Distinguished and Member of Technical Staff Lucent Technologies/Bell Laboratories, North Andover, MA
  • 1985-1988Senior Research Engineer, Scott Paper Company, Philadelphia, PA
  • 1982-1985 Senior Mechanical Engineer, Northrop Corporation, Norwood, MA
  • 1981-1982 Engineer, Stone and Webster Engineering Corp., Boston, MA
  • 1981-1982 (part-time)Consultant, Fibers and Polymers Laboratory, Massachusetts Institute of Technology, Cambridge, MA

Selected Honors and Awards

  • 2011 Named Fellow of the American Society of Mechanical Engineers
  • 2008Best Paper Award, IMAPS Advanced Technology Workshop
  • 2000 Named Consulting Member of Technical Staff (Top 1% of Technical Community), Bell Labs/Lucent Technologies 2000 Bell Labs President's award (Innovative, low cost optical network design and materials solution), Bell Labs/Lucent Technologies
  • 1999 Gold Award (Introducing low cost packaging \ techniques into ATM PON), Bell Labs, Lucent Technologies
  • 1997Environmental Hero Award (Design for assembly and disassembly), Bell Labs/Lucent Technologies
  • 1995Engineering Excellence Award (Peer recognition), AT&T, Bell Laboratories
  • 1981 Textile Veterans Honor Award, Massachusetts Institute of Technology
  • 1980 DuPont Fellowship, Massachusetts Institute of Technology
  • 1977 Tau Beta Pi Engineering Honor Society


  • 2013 "Solid Electrolyte for High Energy Battery" Patent Application
  • 2012 "Package for Integrated Circuit Die", Chinese patent ZL 2008 10188630.0
  • 2012 "Microcircuit Package having Ductile Layer", US RE43,807E
  • 2011 "Plastic Electronic Component Package", US Patent 8,039,945
  • 2010 "Ultra high-temperature plastic package and method of manufacture", US Patent 7,803,307
  • 2010 "Thermoplastic Material", US Patent 7,736,573
  • 2010 "Microcircuit with Ductile Layer" US Patent 7,679,185
  • 2006 "Flange for Integrated Circuit Die," US Patent 7,053,299
  • 2005 "Package for Integrated Circuit Die" US Patent 6, 9867,367
  • 2003 "Dual Network Housing Device", US Patent, 6,510,226
  • 2002 "Patch Antenna Using Non-Conductive Frame", US Patent 6,421,011
  • 2002 "Mounting Opto-Electric Modules on Circuit Boards", US Patent, 6,361,330
  • 1993 "Method of Molding a Thermoplastic Ring onto a Lead frame", US Patent 5,213,748
  • 1992 "Molded Circuit Package Having a Heat Dissipating Post", US Patent 5,172,213 1984 "Fabric Forming Process' U.S. Patent 4,425,691

Selected Papers

  1. "The Effect of Si Die Geometry on the Failure of LDMOS Packages," R. Fragoudakis(g), M.A. Zimmerman, A. Saigal and P. Zhou, 3rd International Conference of Engineering Against Failure (ICEAF III), Kos island, Greece, June 26-28, 2013.
  2. "A Review of TEM Polymer Specimen Preparation," R. Fragoudakis(g), M. A. Zimmerman and A. Saigal, 24th Canadian Congress of Applied Mechanics (CANCAM), Saskatoon, SK, Canada, June 2-6, 2013.
  3. "Non-Contact Dielectric Characterization of Lithium Ionic Solid Electrolyte Polymer," L. Chao(g), M.N. Afsar, M.A. Zimmerman and A. Saigal, IEEE International Instrumentation and Measurement Technology Conference (I2MTC), Minneapolis, MN, May 6-9, 2013.
  4. "Modeling Directionality of Liquid Crystalline Polymers on Arbitrary Meshes," A. Ahmadzadegan(g), M.A. Zimmerman and A. Saigal, Modeling and Numerical Simulation of Material Science (MNSMS), 3(1), January 2013, pp. 1-6. doi:10.4236/mnsms.2013.31001
  5. "Investigating the Rheology of LCPs, through different die geometries" , A. Ahmadzadegan, M.A Zimmerman, and A. Saigal , Characterization of Carbon and Soft Materials Session, Proceedings of TMS (Minerals, Mining and Materials Society), March 15, 2012.
  6. "Development of a new modeling technique for die geometry for extrusion of LCP films", A. Ahmadzadegan, M.A Zimmerman, and A. Saigal ,Proceedings, Annual technical Meeting, Society of Plastics Engineers, Boston, MA, May 5, 2011.
  7. "Reliability of Wedge Wirebonds Subjected to Ultrasonic Welding and Thermal Cycling", J. Battaglia, MA Zimmerman, A Saigal, Proceedings of 2011 TMS Annual Meeting, San Diego, CA February 27-March 3, 2011.
  8. "Stress Analysis of Eutectically Soldered Silicon chips on Copper Flanges with Ductile Layer Technology,", P. Zhou, M.A. Zimmerman, and A. Saigal, Proceedings of 2011 TMS Annual Meeting, San Diego, CA February 27-March 3, 2011.
  9. "Polarization Measurements of Molded Liquid Crystal Polymer/Titania Composites," B. Dantal, A. Saigal, M.A. Zimmerman, K. Korolev, M. Afsar and U. Khan, Proceedings of International Mechanical Engineering Congress and Exposition 2010, Vancouver, British Columbia, Canada, November 12-18, 2010, IMECE2010-37558.
  10. "Multi-lead Organic Air-Cavity Package for High Power High Frequency RFIC' with D, Dougherty, V. Viswanathan, and Mali Mahalingam , Freescale Semiconductor, June 2009. IEEE MTT-S International Microwave Symposium, Proceedings.
  11. "New Structural Polymer for Metal Replacement Applications" with Dan Ward, Chris Lee, and Eric Paszkowski, Rick Boisjoly, Jim Elliott and Michael McGee, Nypro, June 2009. SPE, ANTEC.
  12. "Multi-lead Organic Air-Cavity Package for High Power High Frequency RFIC' with D, Dougherty, V. Viswanathan, and Mali Mahalingam , Free scale Semiconductor, accepted for Publication, June 2009. IEEE MTT-S International Microwave Symposium.
  13. "Revolutionary Polymer for Metal Replacement and Automotive Applications", with C. Buehler and W Rogers, General Motors, 2008 SPE Automotive Composites Conference and Exhibition, Detroit Michigan, September 2008.
  14. "Plastic Air Cavity Package", with C.Lee, SMTA AIMS (Automotive, Industrial, Military and Space) Harsh Environment. Orlando, FL, August 2008.
  15. "Novel Polymer for Metal Replacement in Automotive Applications", SPE Automotive Engineering Plastics Conference, April 2008.
  16. "Millimeter Wave Spectroscopy and Materials Characterization of Refractive Liquid Crystal Polymer/Titania Composites," B. Dantal, A. Saigal, M.A. Zimmerman, K. Korolev, M. Afsar and U. Khan, Materials Characterization 2007, Third International Conference on Computational Methods and Experiments in Material Characterization, Bologna, Italy, June 13-15, 2007