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Contact Information
222
Anderson Hall
Tufts University
Medford, MA 02155
Tel: (617) 627-3239
Fax: (617) 627-3058
Email Professor
Michael A. Zimmerman
Professor of Practice, Tufts University
Department of Mechanical of Engineering
Education
PhD, ME and Applied Mechanics, University of
Pennsylvania, Philadelphia, PA, 1988 (Joint research at
Cavendish Labs/Cambridge University, Cambridge, England)
SM,ME Fibers and Polymers Division, Massachusetts
Institute of Technology, Cambridge, MA, 1981
BS,ME Rensselaer Polytechnic Institute, Troy, NY
Background
Prof Zimmerman spent 14 years at Bell Labs, and rose to the
highest technical level (top 1% of technical community). His
area of expertise is polymer innovation and polymer
processing, semiconductor packaging and electronic and
optical materials. He subsequently started his own company (QLP,
Inc.) by inventing a new liquid crystal polymer technology
and developed products in the area of semiconductor
packages, new printed circuit board materials, and
revolutionary materials for replacing metals in automobiles.
He developed strong collaborative relationships with
Sumitomo Chemical, Dupont, Freescale Semiconductor, and
General Motors, raised > $40M from Venture Capital firms and
strategic partners, qualified the technology in several
major applications, and sold the company to a multinational
company (Interplex Industries). He has been teaching at
Tufts for 20 years, in the areas of materials science,
manufacturing and finite element analysis and has developed
new classes in the areas of polymer science and composite
materials. He has developed projects for over 10 graduate
students (MS and PhD), and has hired many of them.
Research Interest
Prof. Zimmerman’s areas of expertise are in materials,
processing, design for manufacture, computer simulations,
new product ideas, and electronic packaging. He is an
entrepreneur and visionary with extensive international work
experience in Europe and Asia, understands the
entrepreneurial and start-up world.
Professional Positions
2002--Founder, CTO and Board Member Quantum Leap
Packaging, Wilmington, MA, sold to Interplex Industries.
1990-present Professor of Practice/Advisory
Board/Lecturer Tufts University
1988-2002 Consulting, Distinguished and Member of
Technical Staff Lucent Technologies/Bell Laboratories, North
Andover, MA
1985-1988 Senior Research Engineer, Scott Paper
Company, Philadelphia, PA
1982-1985 Senior Mechanical Engineer, Northrop
Corporation, Norwood, MA
1981-1982 Engineer, Stone and Webster Engineering
Corp., Boston, MA
1981-1982 (part-time) Consultant, Fibers and Polymers
Laboratory, Massachusetts Institute of Technology,
Cambridge, MA
Selected Honors and Awards
2008 Best Paper Award, IMAPS Advanced Technology
Workshop
2000 Named Consulting Member of Technical Staff (Top
1% of Technical Community), Bell Labs/Lucent Technologies
2000 Bell Labs President’s award (Innovative, low cost
optical network design and materials solution), Bell
Labs/Lucent Technologies
1999 Gold Award (Introducing low
cost packaging techniques into ATM PON), Bell Labs, Lucent
Technologies
1997 Environmental Hero Award (Design for assembly
and disassembly), Bell Labs/Lucent Technologies
1995 Engineering Excellence Award (Peer recognition),
AT&T, Bell Laboratories
1981 Textile Veterans Honor Award, Massachusetts
Institute of Technology
1980 DuPont Fellowship,
Massachusetts Institute of Technology
1977 Tau Beta Pi
Engineering Honor Society
Patents
Current A number of pending patents
2006 "Flange for Integrated Circuit Die," US Patent
7,053,299
2005 "Package for Integrated Circuit Die" US Patent
6, 9867,367
2003 "Dual Network Housing Device", US Patent,
6,510,226
2002 "Patch Antenna Using Non-Conductive Frame", US
Patent 6,421,011
2002 "Mounting Opto-Electric Modules on Circuit
Boards", US Patent, 6,361,330
1993 "Method of Molding a Thermoplastic Ring onto a
Lead frame", US Patent 5,213,748
1992 "Molded Circuit Package Having a Heat
Dissipating Post", US Patent 5,172,213 1984 "Fabric Forming
Process’ U.S. Patent 4,425,691
Selected Papers
- "New Structural Polymer for Metal Replacement
Applications" with Dan Ward, Chris Lee, and Eric
Paszkowski, Rick Boisjoly, Jim Elliott and Michael
McGee, Nypro, June 2009. SPE, ANTEC.
- "Multi-lead Organic Air-Cavity Package for High
Power High Frequency RFIC’ with D, Dougherty, V.
Viswanathan, and Mali Mahalingam , Free scale
Semiconductor, accepted for Publication, June 2009. IEEE
MTT-S International Microwave Symposium.
- "Revolutionary Polymer for Metal Replacement and
Automotive Applications", with C. Buehler and W Rogers,
General Motors, 2008 SPE Automotive Composites
Conference and Exhibition, Detroit Michigan, September
2008.
- "Plastic Air Cavity Package", with C.Lee, SMTA AIMS
(Automotive, Industrial, Military and Space) Harsh
Environment. Orlando, FL, August 2008.
- "Novel Polymer for Metal Replacement in Automotive
Applications", SPE Automotive Engineering Plastics
Conference, April 2008.
- "Millimeter Wave Spectroscopy and Materials
Characterization of Refractive Liquid Crystal Polymer/Titania
Composites," B. Dantal, A. Saigal, M.A. Zimmerman, K.
Korolev, M. Afsar and U. Khan, Materials
Characterization 2007, Third International Conference on
Computational Methods and Experiments in Material
Characterization, Bologna, Italy, June 13-15, 2007
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