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Capabilities

The following tools are available. Standard Operating Procedures are also available. Click on the title of each tool for more information.

Lithography:

Karl Suss MA6 Mask Aligner
The Suss MA6 contact aligner is a 1000 W mercury lamp UV source contact aligner for performing photolithography. This MA6 is top side alignment only. The exposure source is controlled in constant intensity mode to 20 mW/cm2 at I-line (365 nm). Additional energy will be present at h-line and g-line bringing the total NUV exposure intensity to approximately 60 mW/cm2 (uncalibrated). The aligner can be operated in proximity, soft contact, hard contact, or vacuum contact modes. It accepts 4" (100 mm) wafers and 5" (125 mm) x 5" (125 mm) x 0.09" glass masks.
OAI Model 204IR Mask Aligner
This manual mask aligner is capable of frontside alignment and backside alignment (using transmitted IR light). The aligner has soft contact, hard contact, and vacuum contact modes. The tool has a 350 Watt I-line Near UV lamp calibrated to 20 mW/cm2 intensity at I-line (365 nm). This tool requires training and formal checkout with the faculty supervisor before you may operate it unsupervised.
Laurell WS-400B-6NPP-Lite Manual Spinners
Two manual spinners are used for spin coating photoresist onto wafers. Chucks are available for 2", 4", and 6" wafers and small wafer fragments. Maximum speed is 8000 rpm. These units can also be used for drying wafers.
Convection Ovens
Two Fisher Scientific gravity driven convection ovens are available with 225 degree Celsius maximum temperature. One oven is restricted to standard photoresists, the other has no material restrictions.
Fume Hoods
Two fume hoods are available: one for lithography, solvent processing and alkaline chemistries, and one for acid chemistries such as metal etching and electroplating. Only processes with an approved Standard Operating Procedure (SOP) may be conducted in the hood.
Tescan VEGA3 Sanning Electron Microscope Tescan VEGA3 Scanning Electron Microscope
Modern, fully PC controlled SEM with electrostatic beam blanker and DrawBeam software for electron beam lithography applications. This capability is new to our lab and we are just beginning to understand it's use, we have yet to determine ultimate resolution.

Deposition:

NSC 3000 DC Magnetron Sputter Tool
The Nanomaster NSC-3000 allows DC sputtering of metal thin films (Cr, Ti, Au, Al, Ni), including co-sputtering. This tool requires training with the tool owner and formal checkout by the faculty supervisor.
PDS 2010 Parylene Coater
The PDS2010 allows vapor phase deposition of the polymer Parylene (Poly-para-xylylene) type N, C, and D. This tool requires training with the tool owner and formal checkout by the faculty supervisor.
Angstrom NexDep DC/RF Sputter System
The NexDep sputter system is a dual gun sputter-up system with both DC and RF power supplies. It is possible to co-sputter with one gun in DC mode and one gun in RF mode. The platen is heated. Reactive sputtering is also available with nitrogen and oxygen.
Cambridge Nanotech Savannah Atomic Layer Deposition (ALD) System
The Savannah system is a very popular atomic layer deposition (ALD) platform. Reactive precursors are sequentially pulsed into the chamber for short periods of time. This allows a single layer of material to be deposited per cycle, resulting in very fine thickness control, high uniformity across the substrate, and conformal depositions. A variety of chemistries are available for different materials.
Copper, Nickel, and Gold Electroplating
Electroplating of thick films of copper, nickel, and gold using copper sulfate, nickel sulfamate, and gold sulfite plating chemistries.
LC Tech Thermal Evaporator
Physical vapor deposition of various metal films. The microfab supplies material and boats for deposition of Al, Ti and Cu. Other materials must first be approved for use in the instrument and supplied by the user. Currently Au and Cr have been allowed, please contact us if you are considering another material.

Etching:

Fume Hoods
Two fume hoods are available: one for lithography, solvent processing and alkaline chemistries, and one for acid chemistries such as metal etching and electroplating. Only processes with an approved Standard Operating Procedure (SOP) may be conducted in the hood.
CS1701F Reactive Ion Etcher
A parallel plate RF plasma etcher with SF6, CF4, and O2 as etch gases. Maximum power is 600 W. Minimum pressure during etch is on the order of 10 mT. This tool requires formal checkout by the faculty supervisor.
Tegal Plasmod Oxygen Plasma Cleaner
This Oxygen plasma cleaner has a 4" diameter chamber (it can fit a single 4" diameter substrate). Oxygen plasmas are used for removing organic residues and oxidizing surfaces. It can also be used for PDMS-glass bonding. The unit has a 100 W power supply. There are no restrictions on materials for this tool.
ETP Corona Discharge Wand
The Corona discharge wand utilizes a high frequency generator to produce a plasma at the electrode tip. Useful in the temporary (on the order of several minutes) modification of certain surfaces - polymers can be modified for better adhesion to glass substrates, hydrophobic glass slides can become hydrophilic, etc.

Thermal Processing:

SSI Rapid Thermal Processor
Through the use of high power heating lamps, the SSI RTP can heat samples (wafers, slides) up 1200°C on a time scale of several seconds.
Thermolyne Muffle Furnace
A benchtop muffle furnace is available for annealing samples. The furnace is set up to flow nitrogen for annealing in a nitrogen environment. Maximum temperature is 1000°C. Ramp time is slow (10 mins. up, 1 hour down). Maximum sample size is a 4" wafer.
Convection Ovens
Two Fisher Scientific gravity driven convection ovens are available with 225 degree Celsius maximum temperature. One oven is restricted to standard photoresists, the other has no material restrictions.

Packaging:

MicroAutomation MA1006 Dicing Saw
The MA1006 die saw is used for dicing silicon and glass wafers into smaller pieces. The tool is water cooled and located in the packaging area of the cleanroom. This tool requires training with the tool owner and formal checkout by the faculty supervisor.
Marpet Enterprises MEI1204B Manual Ball Bonder
The manual ball bonder can be used for wirebonding chips to a package. The bonder is capable of handling gold and aluminum wire.
PDS 2010 Parylene Coater
The PDS2010 allows vapor phase deposition of the polymer Parylene (Poly-para-xylylene) type N, C, and D. This tool requires training with the tool owner and formal checkout by the faculty supervisor.
Tousimis Model 810 AutoSamdri Critical Point Dryer (CPD)
Critical point drying is used to reduce adhesion failure and collapse of compliant structures with small gaps during the drying process. This particular unit is intended for drying MEMS devices after the release step where capillary forces in small gaps can cause irreversible "stiction" failure of the device during drying.

Metrology:

Stylus Profilometer – Dektak XT
Stylus profilometers have gained wide acceptance for characterizing thin film thickness, step height, surface roughness and stress
Zygo NewView 600s
The Zygo NewView 600s is a non-contact surface profilometer that uses white light interferometry to measure surface profiles and surface roughness with sub-nanometer precision.
Ocean Optics Nanocalc Film Thickness Measurement
A UV-VIS reflectance-type spectrometer (Ocean Optics Nanocalc) is available. This tool is capable of measuring film thickness of semi-transparent thin films (oxide, nitride, polymer, polysilicon) using a UV-VIS spectrometer and model fitting.
Probestation
A manual probestation is available for probing pieces and wafers up to 6" in diameter. The probestation has vacuum lock and two probes. There is a simple multi-meter for measuring resistance and capacitance. Researchers can bring in additional instrumentation if desired.
Miller FPP-5000 Four Point Probe
A manual four-point probe used for measuring sheet resistance of wafer thin films. Can display sheet resistance or resistivity (if film thickness is known). Up to 6" wafers can fit in the tool.
Inspection Microscope
Three reflectance-type inspection microscopes are available. They have 10X eyepieces and plan-achromatic 4X, 10X, 25X, 40X objectives. There is a color still camera, a color video camera, and computer image capture.
Tescan VEGA3 Sanning Electron Microscope Tescan VEGA3 Scanning Electron Microscope
Fully PC controlled SEM with a heated tungsten filament, motorized specimen stage, SE and BSE detectors and user friendly software. Under ideal conditions 10nm resolution is possible. Equipped with an electrostatic beam blanker and DrawBeam software for electron beam lithography applications.