Standard operating Procedures

Tufts Micro & Nano Fabrication Facility (TMNF)

Tufts University

· SOP Template for Tool Use (Word Doc)

· SOP Template for Chemical Procedure (Word Doc)

 

GENERAL:

· User’s Guide

· Chemical List

 

Metrology:

· Veeco Dektak 6M

· Microscope Image Capture

· Microscope Image Analysis using Image J

· Ocean Optics Nanocalc Thin Film Reflectometer

 

Deposition:

· PDS 2010 Parylene Coating System

· NSC 3000 Sputter Deposition

 

Lithography:

· Standard Photolithography (DQN Resists)

· SU-8 Lithography

· Photodefineable Polyimide Processing (HD-4100 series)

· OAI Aligner

· Laurell Spinner

· Making a Glass Mask from a Transparency Mask

 

Plasma:

· CS1701F Reactive Ion Etcher

· Tegal Plasmod PDMS to Glass Bonding SOP

· Oxygen Plasma Clean

 

Packaging:

· MA1006 Dicing Saw

· MEI1204B Ball Bonder

 

Annealing:

· Thermolyne Muffle Furnace

 

Wet Etching:

· HF Device Release

· Silicon Dioxide Etching with Buffered Hydrofluoric Acid

· Anisotropic Wet Etching of Silicon using Potassium Hydroxide (KOH)

· Isotropic Wet Etching of Silicon using HF/Nitric/Acetic (HNA)

· Wet Etching of Chromium

· Wet Etching of Gold

· Wet Etching of Aluminum

 

Other Chemical Processing:

· PDMS Molding

· Piranha Clean

· Liftoff Processing for Metal Patterning

· Wet Photoresist Strip with Remover 1165

· Non-Photodefineable Polyimide Processing (PI-2600 series)

· PMMA E-beam Resist Processing

· Silk Fibroin Thin Film Processing

· Silk Processing with Bacteriorhodopsin (BR) and 3-(1-pyridinio) propane sulfonate (PPS)

· PolyVinylAlcohol Processing with Bacteriorhodopsin (BR) and 3-(1-pyridinio) propane sulfonate (PPS)

· Silk Fibroin Processing with DCM Dye and “Molecule 10”