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The following tools are available. Standard Operating Procedures are also available. Click on the picture or title of each tool for more information. |
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This 6 foot wide chemistry hood is used for all chemical processing. A compressed dry air gun is available, as well as house vacuum. Only processes with an approved Standard Operating Procedure (SOP) may be conducted in the hood. |
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This Oxygen plasma cleaner has a 4" diameter chamber (it can fit a single 4" diameter substrate). Oxygen plasmas are used for removing organic residues and oxidizing surfaces. It can also be used for PDMS-glass bonding. The unit has a 100 W power supply. There are no restrictions on materials for this tool. |
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The stylus profilometer is used for measuring step heights, surface roughness, and surface features. |
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Capabilities |
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Tufts Micro & Nano Fabrication Facility (TMNF) |
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Tufts University |
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Two manual spinners are used for spin coating photoresist onto wafers. Chucks are available for 2, 4, and 6 wafers and small wafer fragments. Maximum speed is 8000 rpm. These units can also be used for drying wafers. |
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The manual ball bonder can be used for wirebonding chips to a package. The bonder is capable of handling gold and aluminum wire. |
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Two Fisher Scientific gravity driven convection ovens are available with 225 degree Celsius maximum temperature. One oven is restricted to standard photoresists, the other has no material restrictions. |
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Four Corning hotplates are available with 5 degree Celsius temperature control. Maximum temperature 500 C. Two hotplates are for standard photoresists only. The other two have no material restrictions. |
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This manual mask aligner is capable of frontside alignment and backside alignment (using transmitted IR light). The aligner has soft contact, hard contact, and vacuum contact modes. The tool has a 350 Watt I-line Near UV lamp calibrated to 20 mW/cm2 intensity at I-line (365 nm). This tool requires training and formal checkout with the faculty supervisor before you may operate it unsupervised. |
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Two reflectance-type inspection microscopes are available. They have 10X eyepieces and plan-achromatic 4X, 10X, 25X, 40X objectives. There is a color still camera, a color video camera, and computer image capture. |
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The PDS2010 allows vapor phase deposition of the polymer Parylene (Poly-para-xylylene) type N, C, and D. This tool requires training with the tool owner and formal checkout by the faculty supervisor. |
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The Zygo NewView 600s is a non-contact surface profilometer that uses white light interferometry to measure surface profiles and surface roughness with sub-nanometer precision. |
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The MA1006 die saw is used for dicing silicon and glass wafers into smaller pieces. The tool is water cooled and located in the packaging area of the cleanroom. This tool requires training with the tool owner and formal checkout by the faculty supervisor. |
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The Nanomaster NSC-3000 allows DC sputtering of metal thin films (Cr, Ti, Au, Al, Ni), including co-sputtering. This tool requires training with the tool owner and formal checkout by the faculty supervisor. |
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A benchtop muffle furnace is available for annealing samples. The furnace is set up to flow nitrogen for annealing in a nitrogen environment. Maximum temperature is 1000oC. Ramp time is slow (10 mins. up, 1 hour down). Maximum sample size is a 4 wafer. |
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A UV-VIS reflectance-type spectrometer (Ocean Optics Nanocalc) is available. This tool is capable of measuring film thickness of semi-transparent thin films (oxide, nitride, polymer, polysilicon) using a UV-VIS spectrometer and model fitting. |
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A parallel plate RF plasma etcher with SF6, CF4, and O2 as etch gases. Maximum power is 600 W. Minimum pressure during etch is on the order of 10 mT. This tool requires formal checkout by the faculty supervisor. |
