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Research projects that are a bit older have been moved to this page. We're not saying you're old — just kind of marinated.
Comparison of Techniques for Polysilicon Residual \ Stress Measurements
Experimental work comparing wafer curvature measurements,
micro-rotating structures, buckling microstructures, and vibrating
microstructures for the measurement of residual stresses in thin
Calibration Targets for Dual Emission Laser Induced Fluorescence (DELIF)
Calibration wafers have been fabricated to calibrate an optical
measurement technique called Dual Emission Laser Induced
Fluorescence (DELIF), which is used to determine fluid film
thickness between a glass wafer and a polishing pad during Chemical
Mechanical Polishing (CMP). Sqaure wells measuring 1mm2 and 0.25mm2
are etched into these glass wafers to known depths (up to 130um).
The necessary well etch depth depends on the surface roughness of
the polishing pad. In order for fluid layer thickness difference
under the wells to be detectable, the well depth should be at least
3 times the surface roughness of the pad.
Micromachined Shear Stress Sensors for in-situ Monitoring of Surface Forces in ChemiMechanical Planarization
A PDMS microstructure is being developed to measured the
interaction forces that occur between a wafer and a polishing pad
during CMP. The PDMS structures deflect in response to fluid forces
and solid-solid contact forces. An optical method is used to monitor
structure deflection in-situ.
Thermal Design and Fabrication of Microscale Heaters
Microscale heaters with integrated thermistors were fabricated as
an undergraduate research project. The devices use thin sputtered
nickel films for both heating and sensing elements. The processes
involved were standard photolithography, sputtering, and liftoff.
Some of the heaters were functional, and some failed. Residual
stresses, particles, and/or human error in processing appear to have
caused the observed defect in some of the heater lines.
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