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Copper, Nickel, and Gold Electroplating

Electroplating of thick films of copper, nickel, and gold using copper sulfate, nickel sulfamate, and gold sulfite plating chemistries. Films 10 or more microns in thickness can be deposited with deposition rates on the order of 100-200 nm per minute. The plating system can handle small pieces or wafers up to 100 mm in diameter. A conducting seed layer is required. Copper plating using a copper sulfate plating solution is conducted at room temperature. Nickel plating using a nickel sulfamate plating solution is conducted at 50 C. Gold plating using a gold sulfite plating solution is conducted at 58 C. See the procedures below for more details.

Related Standard Operating Procedures: