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March CS1701F Reactive Ion Etcher

A March Plasma systems parallel plate RF plasma etcher. The tool has SF6, CF4, and O2 gases available for etch. Materials that can be etched in this tool include silicon, silicon dioxide, silicon nitride, and organic polymers.

This tool requires formal checkout with the faculty supervisor prior to solo use. To learn , first use the tool with another qualified user to become familiar with operation before you request checkout.

Contacts: Robert White, Jim Vlahakis

Related Standard Operating Procedures: