|Home | Capabilities | Operating Procedures | Research | Gaining Access | People | Safety | Instrument Scheduling | Rates|
Marpet Enterprises MEI1204B Manual Ball Bonder
The manual ball bonder can be used for wirebonding chips to a
package. The bonder is capable of handling gold and aluminum wire.
Contacts: Zhengxin Zhao, Robert White
Related Standard Operating Procedures:
|© 2018 Tufts University | Privacy|