Standard Operating Procedures
Templates
- SOP Template for Chemical Procedure (Word Doc)
- SOP Template for Tool Use (Word Doc)
General
Metrology
- Dektak XT Stylus Profilometer
- Denton Desk V Sputter Coater
- Microscope Image Analysis using Image J
- Microscope Image Capture
- Miller FPP-5000 Four Point Probe
- Ocean Optics Nanocalc Thin Film Reflectometer
- Tescan VEGA3 Scanning Electron Microscope
- Veeco Dektak 6M
- Zygo NewView 600 Interferometer
Deposition
- Angstrom NexDep DC/RF Sputter System
- Electroless Nickel Plating
- Cambridge Nanotech Savannah Atomic Layer Deposition (ALD)
- Copper Electroplating
- Gold Electroplating (Gold Sulfite)
- LC Technologies Thermal Evaporator
- Nickel Electroplating (Nickel Sulfamate)
- NSC 3000 Sputter Deposition
- PDS 2010 Parylene Coating System
- Silver Nanoparticle Deposition
- Spin Coating of PEDOT PSS
- Spin-On Glass Deposition
Lithography and Polymer Processing
- AZ Series Photoresist Processing (AZ9245, AZ9260)
- Karl Suss MA6 Mask Aligner
- Laurell Spinner
- Liftoff Processing using Standard Resists (not LOR)
- Liftoff Processing using Lift Off Resist (LOR/PGMI)
- Making a Glass Mask from a Transparency Mask
- Negative Resist Processing for EBL
- Non-Photodefineable Polyimide Processing (PI-2600 series)
- OAI Aligner
- Omnicoat for SU-8 Liftoff
- PDMS Molding
- Photodefineable Polyimide Processing (HD-4100 series)
- PMMA E-beam Resist Processing
- Polycaprolactone Film Deposition
- Polyimide Thinning Process
- Silk Fibroin Thin Film Processing
- Shadow Nanosphere Lithography
- Standard Photolithography (DQN Resists—1800 series, SPR220 series)
- SU-8 Lithography
- Tescan VEGA3 Scanning Electron Microscope
- Wet Photoresist Strip with Remover 1165
Plasma
- CS1701F Reactive Ion Etcher
- ETP Corona Discharge Wand
- Oxygen Plasma Clean
- Tegal Plasmod PDMS to Glass Bonding SOP
Packaging
Annealing
Wet Etching
- Aqua Regia Etch
- Aluminum Nitride Etch
- Anisotropic Wet Etching of Silicon using Potassium Hydroxide (KOH)
- Decapping ICs: Nitric
- Decapping ICs: Nitric + Sulfuric
- HF Device Release
- Isotropic Wet Etching of Silicon using HF/Nitric/Acetic (HNA)
- Metal Assisted Etching for Silicon
- Silicon Dioxide Etching with Buffered Hydrofluoric Acid
- TFB Nickel Etch
- TFG Nickel Etch
- Wet Etching of Chromium: Transene Type 1020 (nitric:ceric ammonium nitrate)
- Wet Etching of Gold: Gold Etch TFA (Potassium Iodide, Iodine)
- Wet Etching of Aluminum: Transene Aluminum Etch A (phosphoric:nitric:acetic)
- Wet Etching of Aluminum: Aluminum Etchant Type D
- Wet Etching of Copper: Transene APS100 (ammonium persulfate)
- Wet Etching of Copper #2: 1:1:18 Acetic:Peroxide:Water
- Wet Etching of Silver: Nitric Acid
- Wet Etching of Titanium: 1:1:20 HF:Peroxide:Water
- Wet Etching of Titanium #2: Transene TFTN (HCl based)