Jianmin Qu

Jianmin Qu

(617) 627-3237
200 College Avenue
Jianmin Qu

Research/Areas of Interest

micromechanics of composites, interfacial fracture and adhesion, fatigue and creep damage in solder alloys, thermomechanical reliability of microelectronic packaging, defects and transport in solids with applications to solid oxide fuel cells and batteries, ultrasonic nondestructive evaluation of advanced engineering materials, material science

Education

  • Ph.D., Northwestern University, United States
  • M.S., Northwestern University, United States
  • B.S., Jilin University, Changchun, China

Biography

Jianmin Qu is senior vice president for academic affairs and provost at Stevens Institute of Technology. Prior to that, he was Dean of Tufts School of Engineering and Karol Family Professor in the Department of Mechanical Engineering from 2015 to 2021. Prior to joining Tufts, Qu was a Walter P. Murphy Professor in the McCormick School of Engineering and Applied Science at Northwestern University, where he chaired the Department of Civil and Environmental Engineering from 2009 to 2015. Before returning to his alma mater in 2009, he was on the faculty of the School of Mechanical Engineering at the Georgia Institute of Technology from 1989 to 2009.

Qu received his Ph.D. and Master's degrees from Northwestern University in theoretical and applied mechanics and is a fellow of the American Society of Mechanical Engineers. Qu's research focuses on several areas of theoretical and applied mechanics including micromechanics of composites, interfacial fracture and adhesion, fatigue and creep damage in solder alloys, thermomechanical reliability of microelectronic packaging, defects and transport in solids with applications to solid oxide fuel cells and batteries, and ultrasonic nondestructive evaluation of advanced engineering materials. He has authored and co-authored many papers in these areas. His research has been sponsored by the National Science Foundation, the Office of Naval Research, the U.S. Air Force, U.S. Army, DARPA, the Department of Energy, and many industries including Motorola, Ford Motor Co., IBM, AT&T, General Electric, Intel, AMD, and Northrop Grumman.