Alumni work featured in Advancing Microelectronics
Work done by alumnus and double Jumbo Peter Lewis was recently featured as the cover article in the May/June issue of Advancing Microelectronics, which is published by the International Microelectronics and Packaging Society (IMAPS). The article covers lessons learned in the implementation of aerosol jet printing for fabricating multilayer circuit boards.
Written by Lewis, Associate Professor Robert White, and Brian Smith of Draper, the article summarizes work more completely described in Lewis’ master's thesis on aerosol jet deposited conductors and dielectrics for rapid fabrication of heterogeneous electronic systems. Lewis, who completed both his B.S. and M.S. in mechanical engineering at Tufts, is now a full-time engineer at Draper.